第十四届先进陶瓷国际会议
Invited Speakers
S1.先进结构陶瓷和复合材料前沿:从日常使用到极端高温
S2.纳米层状碳化物/氮化物/硼化物及其二维材料
S3. 聚合物前驱体陶瓷
S4. 陶瓷基复合材料前沿
S5. 多孔陶瓷及其在能源与环境中的应用
S6.  先进耐火材料与传统陶瓷
S7.  透明陶瓷与发光材料
S8. 新型陶瓷涂层与技术
S9.  粉体工艺与烧结前沿
S10.3D 打印和增材制造进展
S11.  热电材料与器件
S12. 铁电与压电陶瓷
S13.  铁电与多铁薄膜
S14.  先进储能电介质材料
S15.  新兴光伏材料和器件
S16. 高熵陶瓷:极端环境下设计、加工和应用的创新
S17.  陶瓷材料纳米级表征
S18. 微波介电陶瓷及其应用
S18: Microwave Dielectric Ceramics and Applications

Microwave dielectric ceramics play a key role in the evaluation of wireless communication technology because of their important applications as microwave/millimeter-wave resonators, filters, microwave attenuation and shielding, etc. On the other hand, new devices with superior performance are currently being developed to respond to the requirement of increased channel capacity in ground-based cellular and satellite communications. Device performance is closely related to material properties. In order to meet the needs of present and future microwave systems, improved or new components based on microwave dielectric ceramics and new designs are required. This symposium provides a forum for the worldwide microwave communities from academia and industry to share their vision and insights for microwave dielectric ceramics, to boost the research and development of microwave dielectric ceramics and promote their applications in 5G/6G, V2X, satellite communication/navigation and other information systems.

Proposed sessions :
1. Novel microwave and millimeter-wave dielectric ceramics
2. LTCC/ULTCC materials
3. Microwave absorbing and shielding materials
4. Cold sintering and other novel process for ceramics preparation
5. Components/devices/microsystems based on microwave dielectric ceramics
6. Metamaterials, metasurface and advanced artificial structures
7. Microwave dielectric ceramics and devices design/modeling/simulation/measurements
8. 3D printing /photolithography and other emerging microwave/millimeter wave devices fabrication/integration technologies
9. Microwave circuits package and integration
10. Other microwave dielectric materials related emerging topics

Point of Contact:
Zhifu Liu, Shanghai Institute of Ceramics, CAS, China, liuzf@mail.sic.ac.cn
Organizers:
Xiangming Chen, Zhejiang University, China, Xmchen59@zju.edu.cn
Hong Wang, Southern University of Science and Technology, China, wangh6@sustech.edu.cn
Yang Bai, University of Science and Technology Beijing, China, baiy@mater.ustb.edu.cn
Xiaoxiao Huang, Harbin Institute of Technology, China, swliza@hit.edu.cn
Zhifu Liu, Shanghai Institute of Ceramics, CAS, China, liuzf@mail.sic.ac.cn
Di Zhou, Xian Jiaotong University, China, zhoudi1220@xjtu.edu.cn
Akinori Kan, Meijo University, Japan, akan@meijo-u.ac.jp
Wen Lei, Huazhong University of Technology, China, wenlei@mail.hust.edu.cn
Lei Li, Zhejiang University, China, zjulilei@zju.edu.cn
Feng Shi, Qilu University of Technology, China, sf751106@qlu.edu.cn

Keynote Speakers:
Xiangming Chen, Zhejiang University, China
Akinori Kan, Meijo University, Japan
Yi Huang, Nakai Uniersity, China
Alexy Vasiliev, Dubna state university, Russia
Invited Speakers:
Yang Bai, University of Science and Technology Beijing, China
Xingyu Chen, National University of Defense Technology, China
Yuanbin Chen, Zhaoqing University, China
Yunchen Du, Harbin Institute of Technology, China
Jing Guo, Xian Jiaotong University, China
Weijia Guo, Tsinghua University, China
Chunhong Gong, Henan University, China
Weichang Hao, Beihang University, China
Xiaoxiao Huang, Harbin Institute of Technology, China
Enzhu Li, University of electronic science and technology of China
Lei Li, Zhejiang University, China
Panbo Liu, Northwestern Polytechnical University, China
Zhifu Liu, Shanghai Institute of Ceramics, CAS, China
Juhua Luo, Yancheng Institute of Technology, China
Fanbin Meng, Southwest Jiaotong University, China
Mingsheng Ma, Shanghai Institute of Ceramics,CAS, China
Haiyi Peng, Shanghai Institute of Ceramics, CAS, China
Feng Shi, Qilu University of Technology, China
Feng Wang, Suzhou Lab., China
Guizhen Wang, Hainan University, China
Guangsheng Wang, Beihang University, China
Weiqiang Wang, Nanjing University of Science and Technology, China
Yongzheng Wen, Tsinghua University, China
Long Xia, Harbin Institute of Technology (Weihai), China
Aming Xie, Nanjing University of Science and Technology, China
Hangfeng Zhang, Queen Mary University of London, UK
Di Zhou, Xian Jiaotong University, China
S19.  离子及混合传导陶瓷
S20.  生物陶瓷前沿
S21.数据驱动和人工智能在陶瓷和复合材料中的应用
S22. 传感材料和器件
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